Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
- IFTLE 190 TSMC Focus on Packaging; Samsung Licenses “3D” to GF; More on IBM and the Cloud
- IFTLE 116: A6 applications processor for iPhone 5 from Samsung, but…
- IFTLE 42 IMAPS Device Packaging Conference – Fan Out and Embedded Packaging
- IFTLE 4 Are We All Suffering From 3D Stress?
- IFTLE 132 2012 IEEE IEDM: IBM, RPI, Tohoku Univ and TSMC; Wide IO Memory