- Start-Up Strategic Business Planning
- Customized technical courses
- New Market / Product Development
- Customer Relationship Management
- Due Diligence for Acquisitions and Investments
- Expert Witness Litigation Services
Technical Areas
- Microelectronic Packaging
- 2.5 & 3D Integration
- Bumping & Wafer Level Packaging (WLP)
- Fan-in & Fan-out Packaging
- Integrated Passives
- Thin Film Polymer Dielectrics