Consulting Activities

  • Start-Up Strategic Business Planning
  • Customized technical courses
  • New Market / Product Development
  • Customer Relationship Management
  • Due Diligence for Acquisitions and Investments
  • Expert Witness Litigation Services

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Technical Areas

  • Microelectronic Packaging
  • 2.5 & 3D Integration
  • Bumping & Wafer Level Packaging (WLP)
  • Fan-in & Fan-out Packaging
  • Integrated Passives
  • Thin Film Polymer Dielectrics

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