Chapter 9
“Ceramic Packaging”
Chapter 11
“Polymers in Packaging”
1997
Chapter 10
“New Polymers for Emerging Microelectronic Applications”
1999
Chapter 9
“Thin Film Packaging & Interconnect”
1998
Chapter 10
“Fundamentals of Wafer Level Packaging (WLP)”
2001
Chapter 15
“3d Integration”
2012
