Book Chapters

abook1

Chapter 9
“Ceramic Packaging”
Chapter 11
“Polymers in Packaging”
1997
abook2

Chapter 10
“New Polymers for Emerging Microelectronic Applications”
1999
abook3

Chapter 9
“Thin Film Packaging & Interconnect”
1998
abook4

Chapter 10
“Fundamentals of Wafer Level Packaging (WLP)”
2001
abook5

Chapter 15
“3d Integration”
2012

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