Microelectronic Consultants of NC has been affiliated with TechSearch Int (2006 – 2009) and Yole Developpement (2010 – present) and contributed to the following market studies:
TechSearch Int
2006 “3D Integration at the Wafer Level”
2008 “Through Silicon Via Technology”
2010 “3D Through Silicon Via: Infrastructure & Markets”
Yole Developpement
2011 “Equipment & Materials for 3DIC and WLP”
2011 “FlipChip 2011”
2012 “Polymeric Materials for WLP Applications”
2012 “Si & Glass Interposers”
In addition, all articles in the advanced packaging section of the Yole i-micronews web page entitled “…..: A Closer Look” are written by Dr. Garrou